AA Summer DLAB 2019 - London

AA Summer DLAB
July 22-August 9, 2019
Architectural Association (AA) London campus
36 Bedford Square
London WC1B 3ES
United Kingdom

AA Summer DLAB is experimenting with the integration of advanced computational design, analysis, and large scale prototyping techniques. Now, in its 14th year, Summer DLAB continues to build of its expertise on complex architectural design and fabrication processes, relying heavily on materiality and performance.

The program brings together experts from internationally acclaimed academic institutions and practices, including the AA Emergent Technologies & Design (EmTech) Graduate Programme staff. The research generated at Summer DLAB has been published in international media—ArchDaily, Archinect, Bustler—and peer-reviewed conference papers, SimAUD (Simulation in Architecture and Urban Design), eCAADe (Education and research in Computer Aided Architectural Design in Europe).

AA Summer DLAB investigates the correlations between form, material, and structure through the rigorous implementation of computational methods for design, analysis. Each program cycle devises custom-made architectural processes through the creation of new associations between conventional and contemporary design and fabrication techniques. The research culminates in the design and fabrication of a one-to-one scale prototype realized robotic fabrication techniques to integrate form-finding, material computation, and structural performance.

Computational skills

Summer DLAB’s toolkit includes but is not limited to Rhinoceros, Processing, Grasshopper, and various analysis tools.


The workshop is open to current architecture and design students, PhD candidates, and young professionals. Prior software knowledge is not required.

Application/payment deadline

July 8, 2019

Contact details:
Elif Erdine (Programme Head, AA Summer DLAB)
Email: elif.erdine@aaschool.ac.uk
Website: http://summerdlab.aaschool.ac.uk

More information …

Posted Apr 25, 2019 by Carla Sologuren on Rhino News, etc.